For the Internet of Things (IoT) in the home to become a reality, companies need an open ecosystem approach that addresses all aspects from the IPv6 based mesh networking protocol to the end user experience. This class will explain how Thread fits into the smart home landscape, the key benefits Thread provides and how to take your Thread product concept from an idea to a product in the market using building blocks provided by NXP and other resources in the Thread ecosystem.

About This Course

For the Internet of Things (IoT) in the home to become a reality, companies need an open ecosystem approach that addresses all aspects from the IPv6 based mesh networking protocol to the end user experience. This class will explain how Thread fits into the smart home landscape, the key benefits Thread provides and how to take your Thread product concept from an idea to a product in the market using building blocks provided by NXP and other resources in the Thread ecosystem.

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Course Outline

  • Part Part 1| Defining the IOT Smart Home Market and Technology Drivers
    • Part 1| Defining the IOT Smart Home Market and Technology Drivers
  • Part 2| What is Thread?
    • 2.1| Need for a New Wireless Network & Requirements of a New Mesh Network
    • 2.2| About Thread Group
    • 2.3| IPR Policies & New Membership Tiers
  • Part 3| Introduction to Thread Technology
    • 3| Introduction to Thread Technology
  • Part 4| Technical Overview of Thread
    • 4.1| Network Architecture & Thread End Devices & Border Router & System Communicational Model
    • 4.2| Commissioning & Security
    • 4.3| Thread Certification
  • Part 5| NXP's Thread Solutions
    • 5.1| Thread Hardware Offering & Wireless Connectivity Portfolio
    • 5.2| Thread MCU (RTOS) Border Router & Development Hardware
    • 5.3| Thread MPU (OS) Border Router & Development Hardware
    • 5.4| Thread Router & Low Power End Device
  • Part 6| Examples
    • 6| Examples

All MOSFETs are NOT the same, a truism particularly relevant to motor control. The session will explain how feedback from 50+ companies active in this field has given rise to NXP’s unique MOSFET portfolio and roadmap designed specifically for battery-powered motor control applications. From drones and power tools, to vacuum cleaners and electric lawnmowers, NXP now offers exceptional power components to compliment the company’s microcontroller products. The latest 300A MOSFETs and example Freedom board designs will be demonstrated.

About This Course

All MOSFETs are NOT the same, a truism particularly relevant to motor control. The session will explain how feedback from 50+ companies active in this field has given rise to NXP’s unique MOSFET portfolio and roadmap designed specifically for battery-powered motor control applications. From drones and power tools, to vacuum cleaners and electric lawnmowers, NXP now offers exceptional power components to compliment the company’s microcontroller products. The latest 300A MOSFETs and example Freedom board designs will be demonstrated.

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What you will Learn

The latest 300A MOSFETs overview

Course Outline

  • Part 1| Newer & Bigger Opportunities
  • Part 2| Power MOSFETs Make A Difference
    • 2.1| Key Requirements in Motor Control
    • 2.2| Key Requirements in Motor Control Continued
  • Part 3| NXP Has Optimized Devices
    • 3.1| NextPower Cordless Portfolio
    • 3.2| 150A Maximum Current in TO220
    • 3.3| LFPAK - Toughest Power Package
    • 3.4| LFPAK Copper Clip Advantage
    • 3.5| Additional Benefits of LFPAK
    • 3.6| LFPAK Maximum Current
    • 3.7| Example Data Sheet & Demo System
  • Part 4| Perfect for Solution-Selling with NXP Micros
    • 4.1| What is Solution-Selling?
    • 4.2| System Overview for BLDC Motor Control
    • 4.3| Tools & Information

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

About This Course

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

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What you will Learn

Overview of semiconductor devices and how they are made

Course Outline

  • Part 1| Introduction to Integrated Circuits (ICs)
    • 1.1| Terms & Semiconductor Basics
    • 1.2| MOSFET: The Basic IC Building Block
    • 1.3| CMOS Inverter: How It Works
    • 1.4| Classifying Semiconductor Devices
    • 1.5| Mixed Signal Functions & Intertial Sensing Elements
    • 1.6| Pressure Sensors, Accelerometer Devices & Packaging Trends
    • 1.7| Body Controller Partitioning Diagram & Breakdown of Control Modules
    • 1.8| Photos ICs MPC Overview
    • 1.9| Microns & Nanometers
  • Part 2| The IC Manufacturing Process
    • 2.1| Manufacturing Overview & Fundamental Process
    • 2.2| Preparing Silicon, Ingots & Wafers for ICs
    • 2.3| The Mask-Making Process
    • 2.4| Lithography Process Overview
    • 2.5| Adding Photoresist, Exposure, Developing & Etching
    • 2.6| Diffusion Furnace & Ion Implantation/Annealing
    • 2.7| Metal Deposition & Copper Metalization
    • 2.8| Cleaning & Planarization
  • Part 3| Final Stages
    • 3.1| Elements Used in IC Manufacturing & Class Probes
    • 3.2| FLASH, Backgrind & Test/Assembly
    • 3.3| Testing/Assembly & Package Flow Process
    • 3.4| Overview of Key Processes
    • 3.5| Final Processes
  • Part 4| Needs for IC Design & Manufacture
    • 4.1| NXP Factory Configuration
    • 4.2| NXP Fabs & Typical Fab Equipment Costs
    • 4.3| Business Aspects of Semiconductor Fabrication
    • 4.4| Wafer Costs & The Effect of Process Shrink
    • 4.5| Financial Benefits Slowing & Total Cost of Ownership

Explore the NXP wearable and fitness product roadmap and solutions platform.

About This Course

Explore the NXP wearable and fitness product roadmap and solutions platform.

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What you will Learn

Overivew of NXP Wearables & Fitness Platform solutions

Course Outline

  • Part 1| The Generic Wearable Solution
    • 1| The Generic Wearable Solution
  • Part 2| The NXP Wearable Platform
    • 2| The NXP Wearable Platform
  • Part 3| The NXP Wearable Solution Form Factors
    • 3| The NXP Wearable Solution Form Factors
    • 3.1| Self-awareness & Quantitative Life Solution
    • 3.2| Location & Context Awareness Solution
    • 3.3| Wearable Payment & Transportation Solution
    • 3.4| Wireless Charging Solution
  • Part 4| WaRP-Hybrid Architecture for Smart Watch Platform
    • 4| WaRP-Hybrid Architecture for Smart Watch Platform

Time-Sensitive Networking (TSN), a set of IEEE® 802 Ethernet sub-standards, is making deterministic Ethernet possible – especially for the automotive and industrial markets. This session will cover the advantages of TSN and current TSN standards and products.


About This Course

Time-Sensitive Networking (TSN), a set of IEEE® 802 Ethernet sub-standards, is making deterministic Ethernet possible – especially for the automotive and industrial markets. This session will cover the advantages of TSN and current TSN standards and products.

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Course Outline

  • Part 1| Why Use TSN?
    • 1.1| Current State of Industrial Ethernet
    • 1.2| Time Sensitive Networking (TSN)
    • 1.3| Why TSN?
    • 1.4| TSN Performance Characteristics
  • Part 2| TSN Market Use Cases
    • 2.1| Major Markets for TSN - Automotive & Industrial
    • 2.2| Major Markets for TSN - Pro A/V & Consumer
    • 2.3| TSN in Automotive & Industrial Products
    • 2.4| Industrial Control Solutions
  • Part 3| TSN Technology
    • 3.1| TSN Standards
    • 3.2| TSN Protocols
  • Part 4| TSN Solutions
    • 4.1| TSN Reference Design Boards
    • 4.2| TSN Software Stack & Capabilities
    • 4.3| Use Cases: TSN Controller & Industrial Gateway
    • 4.4| Use Cases: TSN Endpoint & A/V Synchronization

Philips Semiconductor (now NXP Semiconductors) invented the Inter-Integrated Circuit (I2C) as a multi-master, multi-slave serial bus in the early nineteen-eighties.  The bus was intended to be a simple two-wire interface consisting of Serial CLock (SCL) and Serial Data (SDA) lines. However, with the introduction of new peripheral devices, additional pins are most often needed for reset, interrupt, slave address, etc. To further simplify the bus back to a true two-wire interface, while maintaining the these common features and increasing the bus speed, MIPI Alliance is leading the industry in the definition and standardization of a new standard called I3C.  This class will discuss the new features and benefits of the I3C bus and present distinct contrasts between the I2C and I3C specifications.

About This Course

Philips Semiconductor (now NXP Semiconductors) invented the Inter-Integrated Circuit (I2C) as a multi-master, multi-slave serial bus in the early nineteen-eighties. The bus was intended to be a simple two-wire interface consisting of Serial CLock (SCL) and Serial Data (SDA) lines. However, with the introduction of new peripheral devices, additional pins are most often needed for reset, interrupt, slave address, etc. To further simplify the bus back to a true two-wire interface, while maintaining the these common features and increasing the bus speed, MIPI Alliance is leading the industry in the definition and standardization of a new standard called I3C. This class will discuss the new features and benefits of the I3C bus and present distinct contrasts between the I2C and I3C specifications.

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What you will Learn

Features and benefits of the I3C bus and present distinct contrasts between the I2C and I3C specifications.

Course Outline

  • Part 1| Introduction to I2C
    • 1.1| I2C History Part 1 (Release Date, Structure, Clock Speeds)
    • 1.2| I2C History Part 2 (Bus, Pin, & Patent/Licensing Information)
    • 1.3| I2C: The Universal Bus
    • 1.4| Devices With & Without Interrupts
  • Part 2| Shortcomings
    • 2.1| Short Falls of I2C
    • 2.2| Short Falls of I2C Cont.'d
  • Part 3| Features of the New I3C Specification
    • 3.1| Use & Power Improvements
    • 3.2| Two-Wire Multi-Drop Bus
    • 3.3| Backwards Compatibility, Multiple Slaves, Less Wires
    • 3.4| Interrupt Prioritization, Clock Speed, Support Systems, and Power Consumption
    • 3.5| Firmware Changes, Capability Register & Limiting Data Payload
    • 3.6| Communication Using I3C
    • 3.7| Details on I3C Capability Registers & in-Band Interrupts
    • 3.8| Details on Mastering, Late Start/Insertion, Mixed Buses, & HDR Modes
  • Part 4| Status of Specification Development

Healthcare is ripe for disruption. In this class we will outline how NXP IoT products  enable a variety of healthcare solutions that will lower patient costs and improve patient outcomes.

About This Course

Healthcare is ripe for disruption. In this class we will outline how NXP IoT products enable a variety of healthcare solutions that will lower patient costs and improve patient outcomes.

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Course Outline

  • Part 1| Harnessing the IoT
    • 1.1| Defining IoT
    • 1.2| Establishing a Solution
  • Part 2| What can NXP do to Enable the Healthcare IoT?
    • 2.1| NXP Healthcare Solutions - Diabetes, Cardiac Care & Smart Pharma
    • 2.2| NXP Healthcare Solutions - Body Area Network Application
  • Part 3| How do I Ensure My IoT Solution is Interoperable?
    • 3.1| Today's Wireless Landscape
    • 3.2| Interoperability Challenges & Personal Connected Healthcare Alliance
    • 3.3| LNI: End-to-End Architecture
    • 3.4| Technology & Software Architecture
    • 3.5| Details About HealthLink Hub & Health@Home Exchange
  • Part 4|
    • 4.1| IoT is Imperative
    • 4.2| Challenges for Medical Security
    • 4.3| The Security Thought Model
    • 4.4| Where is Security Important?
    • 4.5| FDA Requirements
    • 4.6| Security use Cases - medical Ecosystems
    • 4.7| Secure Element Integration for Online & Offline Devices

The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management.   An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers.

About This Course

The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management. An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers.

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What you will Learn

An overview of current supply chain systems integration activities.

Course Outline

  • Part 1| The New NXP
  • Part 2| Manufacturing Network Strategy
    • 2.1| Global Reach
    • 2.2| Leveraging Foundry Relationships
  • Part 3| Dual Sourcing Strategy
    • 3.1| Overview of NXP Strategy
    • 3.2| Front-End & Back-End Manufacturing Facilities & Supply Continuity
  • Part 4| Supply Chain Planning Overview
    • 4.1| Supply Chain Operations MT
    • 4.2| Customer Supply Chain
    • 4.3| NXP Standard Production Flow
    • 4.4| Sales & Ops Process - High Level Overview
  • Part 5| Lead Time
    • 5.1| Comparing Manufacturing Cycle Time & Order Lead Time
    • 5.2| The Firm Order Supply Chain Model
    • 5.3| Vendor Managed Inventory (VMI) Process
    • 5.4| Consignment vs. Reduced Lead Time (RLT)
  • Part 6| Customer Order Migration/Billing Entity Changes
    • 6.1| Timeline for Order Book & Billing Entity Changes
    • 6.2| NXP & Customers Begin EDI Now
    • 6.3| NXP Billing Entity Changes by Region
  • Part 7| Billing Continuity & Crisis Management
    • 7.1| Business Continuity Management
    • 7.2| Global Manufacturing & Shipping Sites
    • 7.3| NXP Factory/Site Asset Rick Management Approach
    • 7.4| Overall Business Continuity & Risk Management - Four Tier Approach

Learn about NXP's newest technology for Single Chip System Modules (SCM) that provides ultimate customization and tiny form-factor via a unique vertical integration approach.

About This Course

Learn about NXP's newest technology for Single Chip System Modules (SCM) that provides ultimate customization and tiny form-factor via a unique vertical integration approach.

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What you will Learn

NXP's newest Single Chip System Modules (SCM) overview

Course Outline

  • Part 1| Introduction
    • 1.1| Target Markets for Solutions
    • 1.2| Accelerating Customer's Time-to-Revenue
  • Part 2| What is an SCM?
    • 2.1| About the First Product Launched & Family 1 (SCM - i.MX 6D/6Q)
    • 2.2|
    • 2.3| SCM-i.MX 6D/6Q Collateral
    • 2.4| Derivative Products for Family 1
  • Part 3| Single Chip Module Roadmap & Intro to 2 New Families in SCM Family
    • 3.1| Product Roadmap
    • 3.2| Overview of The SCM-i.MX 6SX
    • 3.3| The SCM V-Link Hybrid Module - Motivation for Developing
    • 3.4| Overview of the SCM - i.MX 6SX V-Link
    • 3.5| Product Details of The SCM - i.MX 6SX V-Link
    • 3.6| SCM Development Support
  • Part 4| Partner Demos Utilizing V-Link
    • 4.1| Boundary Devices - Overview
    • 4.2| Boundary Devices - SCM Demo Application
    • 4.3| CODE - Overview of WiFi Border Router Solution
    • 4.4| CODE - The Design Process & Key Benefits
    • 4.5| FirstView - Company Overview & Limitations of Monitoring Devices Today
    • 4.6| FirstView - How SCM Enabled a Wearable Medical Device & Block Diagram
    • 4.7| FirstView - The Benefits of V-Link SCM