Charging smartphones without the need to plug in a charging wire increases convenience and enables on-the-move charging in public spaces. First generation wireless chargers consist of over 100 components and are too expensive for mass market adoption. The NXQ1TXH5 is a one-chip Qi low power wireless charging transmitter integrating all the digital, analog and power functions for a Qi wireless charger. The high integration enables a very low component count and an easy to design wireless charger. This also reduces the cost of a wireless charger by as much as a factor 3. The NXQ1TXH5 is a real digital plug & play platform without the need for external analog design effort. A 2-layer PCB with signal & power routing at the top layer and a full copper bottom layer for thermal performance is all you need. Connect power supply and decoupling at the input and an LC circuit at the output to transmit the power to the receiver, and your wireless charger is ready to go!

About This Course

Charging smartphones without the need to plug in a charging wire increases convenience and enables on-the-move charging in public spaces. First generation wireless chargers consist of over 100 components and are too expensive for mass market adoption. The NXQ1TXH5 is a one-chip Qi low power wireless charging transmitter integrating all the digital, analog and power functions for a Qi wireless charger. The high integration enables a very low component count and an easy to design wireless charger. This also reduces the cost of a wireless charger by as much as a factor 3. The NXQ1TXH5 is a real digital plug & play platform without the need for external analog design effort. A 2-layer PCB with signal & power routing at the top layer and a full copper bottom layer for thermal performance is all you need. Connect power supply and decoupling at the input and an LC circuit at the output to transmit the power to the receiver, and your wireless charger is ready to go!

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What you will Learn

The high integration of NXQ1TXH5

Course Outline

  • Part 1| Introduction to Wireless Charging
    • 1.1| What is Wireless Charging?
    • 1.2| Wireless Power Technology Overview
    • 1.3| Wireless Power System - Overview & Comparison
    • 1.4| NXP Wireless Charging Solution Ecosystem - Enabled Products
  • Part 2| Qi Wireless Charging Technology
    • 2.1| The Qi System - Power & Control Loop
    • 2.2| Qi Transmitter Designs
    • 2.3| Transmitter Ping & Charge Modes
    • 2.4| Communication & Power Transfer
  • Part 3| NXQ1TXH5 Low-Power Qi Transmitter
    • 3.1| Key Features & Block Diagram
    • 3.2| Dual ASK Channels
    • 3.3| Static Power Reduction Configuration
    • 3.4| Foreign Object Detection Threshold Configuration
    • 3.5| Foreign Object Detection Error Configuration
    • 3.6| LED Mode Configuration
    • 3.7| Designing with NXQ1TXH5
  • Part 4| System Application Information

The RF content of connected devices has been increasing dramatically the last couple of years. The increasing bandwidth demand has driven the requirements of the RF chain to higher levels. The RF MMICs from NXP Smart Antenna Solutions give designers of connected devices freedom of antenna placement while achieving higher performance. This class will show the increasing requirements and complexity and NXPs answer to this challenge.

About This Course

The RF content of connected devices has been increasing dramatically the last couple of years. The increasing bandwidth demand has driven the requirements of the RF chain to higher levels. The RF MMICs from NXP Smart Antenna Solutions give designers of connected devices freedom of antenna placement while achieving higher performance. This class will show the increasing requirements and complexity and NXPs answer to this challenge.

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What you will Learn

NXP's Solution for RF Smart Antenna

Course Outline

  • Part 1| Network Evolution for High Speed Data
    • 1.1| Challenges of Future Networks
    • 1.2| Future Network Evolution (WiFi, LEO & MESH)
    • 1.3| Future Network Evolution (WiFi, LEO & MESH)
    • 1.4| Network Architecture Evolution
    • 1.5| Infrastructure Trends
  • Part 2| NXP RF Technology for Network Applications
    • 2.1| QUBiC Overview
    • 2.2| QUBiC Overview Continued
    • 2.3| Technology Per Network Application
  • Part 3| NXP Small Cell Solutions
    • 3.1| Matching Technology to Trends
    • 3.2| Small Cell Block Diagram
  • Part 4| Platforms & Boards.
    • 4.1| LNA IP Platform & Platform Integration Benefits
    • 4.2| Configurable PA Benefits
    • 4.3| Small Cell Demo Board Features

With 5G solutions still being in the design phase, NXP delivers RF solutions based to meet the growing data demand. These solutions are called 4.5G and are based on smart combinations of existing 4G and Wifi technology and will enable a high throughput internet connections everywhere on this planet. This lecture will show you the existing 4G and Wifi RF solutions and how they can be utilized for 4.5 G networks and which steps need to be taken to bring these solutions towards the 5G network.

About This Course

With 5G solutions still being in the design phase, NXP delivers RF solutions based to meet the growing data demand. These solutions are called 4.5G and are based on smart combinations of existing 4G and Wifi technology and will enable a high throughput internet connections everywhere on this planet. This lecture will show you the existing 4G and Wifi RF solutions and how they can be utilized for 4.5 G networks and which steps need to be taken to bring these solutions towards the 5G network.

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What you will Learn

4G and Wifi RF solutions and how they can be utilized for 4.5 G networks

Course Outline

  • Part 1| Evolution of Throughput & Radio Access Network
    • 1| Evolution of Throughput & Radio Access Network
  • Part 2| The 5G Systems
    • 2| The 5G Systems
  • Part 3| Low Earth Orbit Systems
    • 3| Low Earth Orbit Systems
  • Part 4|
    • 4.1| mmWave to Array Antennas
    • 4.2| Array Antenna to Phased Array
    • 4.3| Array Factor to Linear Case
    • 4.4| Beamforming Options
    • 4.5| Massive MIMO
    • 4.6| Existing Array System
    • 4.7| Trial System from Ericsson
  • Part 5| NXP Offerings
    • 5.1| NXP Capabilities
    • 5.2| The KuDownconverter
    • 5.3| 5G mmWave TX: Ka IQ Mod w/ LO POVM
    • 5.4| NXPs Approach to 5G

Ultra Wide Band (UWB) is just about to enter the automotive space. UWB in automotive NXP enables new convenience and functional safety use cases and an increased level of security. In this session we will disucss UWB - RF technology used in the automotive domain, specifically for secure car access systems. We provide an overview of customer needs and explain advanced features and the potential of this brandnew NXP solution.

About This Course

Ultra Wide Band (UWB) is just about to enter the automotive space. UWB in automotive NXP enables new convenience and functional safety use cases and an increased level of security. In this session we will disucss UWB - RF technology used in the automotive domain, specifically for secure car access systems. We provide an overview of customer needs and explain advanced features and the potential of this brandnew NXP solution.

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What you will Learn

Features and the potential of this brandnew NXP solution on RF

Course Outline

  • Part 1| Vehicle Access Applications
    • 1.1| NXP & Car Access
    • 1.2| Types of Secure Car Access Applications
    • 1.3| UWB Increases Range for Advanced Car Access
  • Part 2| UWB-Automotive Use Cases
    • 2.1| Functional Safety & Convenience Functions
    • 2.2| Autonomous Driving, Connectivity, & Security Functions
    • 2.3| Details of a Relay Attack
    • 2.4| Distance Bonding is an Effective Defense
    • 2.5| Classic Keyless Entry
    • 2.6| Implementing UWB into Keyless Entry
  • Part 3| UWB - Principle
    • 3.1| UWB Transmission Band Overview
    • 3.2| 3 Data Modulation Schemes & Transmission Channels
    • 3.3| Time of Flight & Ranging Communication Scheme
    • 3.4| Performance Parameters & Technical Data

Solid state RF energy provides cooking appliance OEMs the opportunity to create differentiated cooking appliances. When combined with emerging food services, these appliances can enable greater levels of consumer convenience while delivering consistent cooking results. This session will cover the underlying basics of how solid state RF cooking is performed, its benefits, and how it can be combined in an IoT appliance to deliver even further differentiation.

About This Course

Solid state RF energy provides cooking appliance OEMs the opportunity to create differentiated cooking appliances. When combined with emerging food services, these appliances can enable greater levels of consumer convenience while delivering consistent cooking results. This session will cover the underlying basics of how solid state RF cooking is performed, its benefits, and how it can be combined in an IoT appliance to deliver even further differentiation.

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What you will Learn

How solid state RF cooking is performed

Course Outline

  • Part 1| Market Dynamics
    • 1.1| Summary
    • 1.2| Market Dynamics
    • 1.3| Cooking Appliance Trends
  • Part 2| What is RF Cooking
    • 2.1| Cooking With RF Comparison
    • 2.2| Solid State RF Cooking: Real Time Control Is Key
    • 2.3| What Makes RF Cooking Useful for IoT
  • Part 3| Cooking Appliance Requirements
    • 3.1| Oven Requirements
    • 3.2| Intelligent Solid State RF Oven Block Diagram
    • 3.3| The Connected Service Platform
    • 3.4| SAGE Intelligent Cooking Appliance & NXP Solutions
    • 3.5| Customer Benefit

There are many variables to consider when implementing and integrating solid state RF power into a cooking appliance. Cavity size and shape, RF feed type, power, thermals, and configuration all factor into design consideration. This session will cover key consideration and methods of simulating to achieve better system design.

About This Course

There are many variables to consider when implementing and integrating solid state RF power into a cooking appliance. Cavity size and shape, RF feed type, power, thermals, and configuration all factor into design consideration. This session will cover key consideration and methods of simulating to achieve better system design.

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Course Outline

  • Part 1| Principle of Microwave Heating
    • 1.1| Overview of Microwave Heating Properties
    • 1.2| Hot & Cold Spot Issues
  • Part 2| Microwave Cavity
    • 2.1| Microwave Cavity Efficiency
    • 2.2| Electric Field Mode Patterns
    • 2.3| Observation Conclusions
  • Part 3| Effect of Load Properties
    • 3.1| Properties of Different Kinds of "Foods"
    • 3.2| Properties of Different Kinds of "Foods" Continued
  • Part 4| Effect of Feed Sources
    • 4.1| The Effect of Frequency
    • 4.2| The Effect of Phase
    • 4.3| The Effect of Amplitude
  • Part 5| Antenna Properties
    • 5.1| Microstrip Patch Antenna
    • 5.2| Phase Control
    • 5.3| Amplitude Control
    • 5.4| Mutual Coupling
  • Part 6| Dual-Source Microwave Oven
    • 6.1| The Simulation
    • 6.2| Simulation Continued
    • 6.3| Simulation Results Table
    • 6.4| Return Power from Each Port
    • 6.5| Energy Absorbed by Load
  • Part 7| Quad-Source Microwave Oven
    • 7.1| Simulation
    • 7.2| Simulation Results
  • Part 8| Next Step

Designing solid state RF solutions to deliver controllable, high efficiency energy for consumer cooking appliances requires designers to carefully consider size, cost, and performance objectives. This session will cover NXP's approach to a scalable, modular platform for delivering controllable RF energy for integration into cooking appliances.

About This Course

Designing solid state RF solutions to deliver controllable, high efficiency energy for consumer cooking appliances requires designers to carefully consider size, cost, and performance objectives. This session will cover NXP's approach to a scalable, modular platform for delivering controllable RF energy for integration into cooking appliances.

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What you will Learn

  • RF energy for integration into cooking appliances.

Course Outline

  • Part 1| Why RF Cooking?
    • 1.1| RF Cooking Advantages
    • 1.2| RF Cooking Advantages Continued
    • 1.3| Proof Points - Multi Component Dishes
    • 1.4| Comparing RF Energy to Convection
  • Part 2| Challenges
    • 2| Challenges
  • Part 3| System Architecture
    • 3.1| Implemented Architecture
    • 3.2| Modular, Master Slave Diagram Explanation
    • 3.3| Modular, Master-Slave Advantages
  • Part 4| RF Sub-System
    • 4.1| Module Block Diagram
    • 4.2| Module Features & Performance
    • 4.3| Prototype Circuit Layout
    • 4.4| Software & API Overview
    • 4.5| Interconnect
  • Part 5| RF Devices: Key to Success
    • 5.1| MHT1004N - 300W Discrete
    • 5.2| The Drive Up Curve - Efficiency vs. Power & Pin vs. Pout
    • 5.3| Design Example: Sage

In designing cooking appliances, there is ample consideration given to power required from a home's wired electrical system as well as the performance needed to maintain safety and operating temperatures. NXP's solid state RF cooking team has partnered with Wayv Technology to develop a portable food heating appliance using solid state RF energy. This session will cover the key challenges and approaches to delivering energy to heat food in a portable, on-the-go appliance.

About This Course

In designing cooking appliances, there is ample consideration given to power required from a home's wired electrical system as well as the performance needed to maintain safety and operating temperatures. NXP's solid state RF cooking team has partnered with Wayv Technology to develop a portable food heating appliance using solid state RF energy. This session will cover the key challenges and approaches to delivering energy to heat food in a portable, on-the-go appliance.

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Course Outline

  • Part 1| Introduction to NXPs RF Power Portfolio
    • 1| Introduction to NXPs RF Power Portfolio
  • Part 2| The Wayv Portable Cooking Appliance
    • 2.1| Market Overview
    • 2.2| Targeted Users
    • 2.3| Collaboration of Wayv & NXP
  • Part 3| Principles of RF Heating
    • 3.1| Review of Principles
    • 3.2| Key Considerations
  • Part 4| Product Design & Operation
    • 4.1| Product Characteristics
    • 4.2| The Design Challenge
    • 4.3| A High Level Electrical Block Diagram
  • Part 5| Selection of Design Considerations
    • 5.1| Cavity Heating Details
    • 5.2| Amplifier Device Selection
    • 5.3| Calculated Amplifier Line Up Budget
    • 5.4| Power Amplifier Design
    • 5.5| Heating Algorithm
    • 5.6| Heating Algorithm Continued
  • Part 6| Heating Results
    • 6| Heating Results